542-91-6

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DIETHYLSILANE

Product Code: SID3415.0

Cas No: 542-91-6

R&D quantities:

50 g
$242.00
10 g
$61.00
Dialkyl Silane Reducing Agent

Organosilanes are hydrocarbon-like and possess the ability to serve as both ionic and free-radical reducing agents. These reagents and their reaction by-products are safer and more easily handled and disposed than many other reducing agents. The metallic nature of silicon and its low electronegativity relative to hydrogen lead to polarization of the Si-H bond yielding a hydridic hydrogen and a milder reducing agent compared to aluminum-, boron-, and other metal-based hydrides. A summary of some key silane reductions are presented in Table 1 of the Silicon-Based Reducing Agents brochure.

Diethylsilane; Diethyldihydrosilane
  • Viscosity, 25°: 0.4 cSt
  • ΔHcomb: -3,981 kJ/mol
  • ΔHform: -155 kJ/mol
  • ΔHvap: 30.1 kJ/mol
  • Employed in oxygen plasma assisted deposition of SiO2 for microelectronics
  • Directs the borylation of N-containing heterocycles
  • Allows direct functionalization of C–H bonds. Forms 1,3-diols from alcohols in good yields
  • Reduces esters to aldehydes in excellent yields
  • Used in the ‘in-situ’ preparation of diborane and haloboranes
  • Extensive review of silicon based reducing agents: Larson, G.; Fry, J. L. "Ionic and Organometallic-Catalyzed Organosilane Reductions", Wipf, P., Ed.; Wiley, 2007
  • Boiling Point: 56°

    EINECS Number: 208-834-9

    Melting Point: -132°

    Molecular Weight: 88.22

    Specific Gravity: 0.6837

    Flashpoint: -20°C (-4°F)

    HMIS Key: 3-4-1-X

    Hydrolytic Sensitivity: 3: reacts with aqueous base

    Formula: C4H12Si

    Refractive Index: 1.3921

    TSCA: TSCA

    Application: Employed in oxygen plasma assisted deposition of SiO2 for microelectronics.1
    Directs the borylation of N-containing heterocycles.2
    Allows direct functionalization of C-H bonds. Forms 1,3-diols from alcohols in good yields.3
    Reduces esters to aldehydes in excellent yields.4

    Reference: 1. Levy, R. et al. Chem. Mater. 1993, 5, 1710.
    2. Robbins, D. W. et al. J. Am. Chem. Soc.. 2010, 132, 4068.
    3. Simmons, E. M.; Hartwig, J. F. Nature 2012, 483, 70; DOI: 10.1038/nature10785
    4. Cheng, C.; Burkhart, M. Angew. Chem., Int. Ed. Engl. 2012, 51, 9422.

    Additional Properties: 218
    ?Hcomb: -951 kcal/mole
    ?Hform: -37 kcal/mole
    ?Hvap: 7.18 kcal/mole