MEMS are micro-electro-mechanical structures produced by methodologies generally consistent with scales and techniques associated with monolithic integrated circuit (microchip) fabrication. The integration of mechanical sensors and actuators involves a broader range of material technologies and concerns than in integrated circuit technology.

Listed below are materials specifically used for MEMS. Please consult Gelest Application Sites for “Chemical Vapor Deposition”, “Nanotechnology”, “Self-“Assembled Monolayers” and “Dielectrics”.

Silicon Dioxide Thin Films - CVD Precursors

SIT7110.2

TETRAETHOXYSILANE, 99.9+%

SID2790.0

DI-t-BUTOXYDIACETOXYSILANE, tech-96

SID2754.6

DIBENZYLOXYDIACETOXYSILANE, tech-95

UV Conversion Coatings

These materials develop directly to SiO2 on exposure to deep UV

SST-BBE1.2

POLY(2-BROMOETHYLSILSESQUIOXANE), 14-16% in methoxypropanol

Anti-stiction Coatings - Siloxane Class

SIO6705.1

OCTAPHENYLCYCLOTETRASILOXANE, 98%

SIT7530.0

1,3,5,7-TETRAMETHYLCYCLOTETRASILOXANE

Anti-stiction Coatings - Fluorosilane Class

SIT8175.0

(TRIDECAFLUORO-1,1,2,2-TETRAHYDROOCTYL)TRIETHOXYSILANE

SIB1710.0

BIS(PENTAFLUOROPHENYL)DIMETHOXYSILANE

©

Copyright 1991 - 2017 Gelest, Inc.

site by Think it First