MEMS are micro-electro-mechanical structures produced by methodologies generally consistent with scales and techniques associated with monolithic integrated circuit (microchip) fabrication. The integration of mechanical sensors and actuators involves a broader range of material technologies and concerns than in integrated circuit technology.

Listed below are materials specifically used for MEMS. Please consult Gelest Application Sites for “Chemical Vapor Deposition”, “Nanotechnology”, “Self-“Assembled Monolayers” and “Dielectrics”.

Silicon Dioxide Thin Films - CVD Precursors

icon

SIT7110.2

TETRAETHOXYSILANE, 99.9+%

icon

SID2790.0

DI-t-BUTOXYDIACETOXYSILANE, tech-96

icon

SID2754.6

DIBENZYLOXYDIACETOXYSILANE, tech-95

UV Conversion Coatings

These materials develop directly to SiO2 on exposure to deep UV

icon

SST-BBE1.2

POLY(2-BROMOETHYLSILSESQUIOXANE), 14-16% in methoxypropanol

Anti-stiction Coatings - Siloxane Class

icon

SIO6705.1

OCTAPHENYLCYCLOTETRASILOXANE, 98%

icon

SIT7530.0

1,3,5,7-TETRAMETHYLCYCLOTETRASILOXANE

Anti-stiction Coatings - Fluorosilane Class

icon

SIT8175.0

(TRIDECAFLUORO-1,1,2,2-TETRAHYDROOCTYL)TRIETHOXYSILANE

icon

SIB1710.0

BIS(PENTAFLUOROPHENYL)DIMETHOXYSILANE

©

Copyright 1991 - 2018 Gelest, Inc.