14781-45-4

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COPPER(II) HEXAFLUORO-2,4-PENTANEDIONATE, dihydrate

Product Code: AKC253

Cas No: 14781-45-4

Pack Size

Price

5 g
$60.00
50 g
$410.00
ALD Material

Atomic layer deposition (ALD) is a chemically self-limiting deposition technique that is based on the sequential use of a gaseous chemical process. A thin film (as fine as -0.1 Å per cycle) results from repeating the deposition sequence as many times as needed to reach a certain thickness. The major characteristic of the films is the resulting conformality and the controlled deposition manner. Precursor selection is key in ALD processes, namely finding molecules which will have enough reactivity to produce the desired films yet are stable enough to be handled and safely delivered to the reaction chamber.

Copper (II) hexafluoro-2,4-pentanedionate, dihydrate; Cupric hexafluoroacetylacetonate
  • Vapor pressure, 50 °C: 1 mm
  • Vapor pressure, 95 °C: 10 mm
  • Solubility, methanol: >200 g/L
  • Soluble: methanol, acetone, toluene
  • Employed in CVD of superconductors
  • Catalyst for addition of diazopentanediones to aldehydes and ketones to form dioxoles
  • Cu thin films deposited with H2 at 250 °C
  • Forms ferromagnetic chains on photolysis with diazodi-4-pyridylmethane
  • Boiling Point: 100° / 0.5 sub

    EINECS Number: 238-850-1

    Melting Point: 130°

    Molecular Weight: 477.64/513.68

    HMIS Key: 3-1-0-X

    Application: Employed in CVD of superconductors.1
    Catalyst for addition of diazopentanediones to aldehydes and ketones to form dioxoles.2
    Cu thin films deposited with H2 at 250°.3,4,5
    Forms ferromagnetic chains on photolysis with diazodi-4-pyridylmethane.6

    Reference: 1. Nemota, M. et al. J. Mater. Res. 1990, 5, 1.
    2. Alonso, M. et al. J. Org. Chem. 1985, 50, 3445.
    3. VanHemert, R. et al. J. Electrochem. Soc. 1965, 112, 1123.
    4. Mosher, R. et al. U.S. Patent 3,356,527, 1967.
    5. Eisenbraun, E. et al. In Advanced Metallization for ULSI Applications, 1992, Cale, T. et al. Ed.;MRS, 1993, p. 107.
    6. Sano, Y. et al. J. Am. Chem. Soc. 1997, 119, 8246.

    Additional Properties: Soluble: methanol, acetone, toluene
    Solubility, methanol: >200 g/l
    Vapor pressure, 50°: 1 mm
    Vapor pressure, 95°: 10 mm