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Boiling Point: 186-8°
EINECS Number: 213-773-6
Melting Point: -10°
Molecular Weight: 219.51
Specific Gravity: 0.922
Flashpoint: 61°C (142°F)
HMIS Key: 2-2-1-X
Hydrolytic Sensitivity: 7: reacts slowly with moisture/water
Refractive Index: 1.4448
Application: Modifies positive resists for O2 plasma resistance.1
Polymerizes to polydimethylsilazane oligomer in presence of Ru/H2.2
Silylation reagent for diols.3
Reference: 1. Babich, E. et al. Microelectron. Eng. 1990, 11, 503.
2. Blum, Y. et al. U.S. Patent 4,216,383, 1986; U.S. Patent 4,788,309, 1988.
3. Birkofer, L. et al. J. Organomet. Chem. 1980, 187, 21.
Additional Properties: Dipole moment: 0.92 debyeDielectric constant, 1000Hz: 2.57?Hform: 132 kcal/moleViscosity, 20°: 1.7 cSt