All structures are computer generated. Please rely on the product data below for placing your order. If you see any errors in structures, please email customer service so that they can be addressed.


Product Code: AKC260

Cas No: 13395-16-9

250 g
50 g
ALD Material

Atomic layer deposition (ALD) is a chemically self-limiting deposition technique that is based on the sequential use of a gaseous chemical process. A thin film (as fine as -0.1 Å per cycle) results from repeating the deposition sequence as many times as needed to reach a certain thickness. The major characteristic of the films is the resulting conformality and the controlled deposition manner. Precursor selection is key in ALD processes, namely finding molecules which will have enough reactivity to produce the desired films yet are stable enough to be handled and safely delivered to the reaction chamber.

Copper (II) 2,4-pentanedionate; Cupric acetylacetonate
  • Color: pale blue
  • Metal content: 2.8-24.5% Cu
  • Vapor pressure, 100 °C: 0.001 mm
  • Vapor pressure, 163 °C`: 0.1 mm
  • Solubility, dimethylsulfoxide: 4.4 g/L
  • Solubility, toluene: 0.4 g/L
  • Solubility, water: 0.2 g/L
  • Stability constant, pKa dioxane/water: 9.7
  • Catalyst for the reduction of nitro-aromatics NaBH4
  • Catalyst for hydrogenation of unsaturated fats
  • Catalyst for flexible urethanes
  • Excimer laser induces deposition of copper
  • Metal-Organic Chemical Vapor Deposition (MOCVD) generates copper oxide films
  • Forms ferromagnetic chains on photolysis with diazodi-4-pyridylmethane
  • EINECS Number: 236-477-9

    Specific Gravity: 1.594

    HMIS Key: 3-1-1-X

    Hydrolytic Sensitivity: 4: no reaction with water under neutral conditions

    Formula: C10H14CuO4


    Application: Catalyst for the reduction of nitro-aromatics with NaBH4.1
    Catalyst for hydrogenation of unsaturated fats.2
    Catalyst for flexible urethanes.3
    Excimer laser induces deposition of copper.4
    MOCVD generates copper oxide films.5
    Forms ferromagnetic chains on photolysis with diazodi-4-pyridylmethane.6

    Reference: 1. Hanaya, K. et al. J. Chem. Soc., Perkin Trans. 1979, 1, 2409.
    2. Emken, E. et al. J. Am. Oil Chem. Soc. 1966, 43, 14.
    3. Chem. Abstr. 68, 3566d; Fr. Patent 1,481,815, 1968.
    4. Jones, C. et al. Appl. Phys. Lett. 1985, 46, 97.
    5. Ryabova, L. In Current Topics in Material Science Kaldis, E. Ed. 1981, 7, 598.
    6. Sano, Y. et al. J. Am. Chem. Soc. 1997, 119, 8246.

    Additional Properties: Solubility, toluene: 0.4 g/l
    Solubility, water: 0.2 g/l
    23.8-24.5% Cu
    Pale Blue
    dimEthylsulfoxide 4.4 g/l
    Vapor pressure, 163°: 0.1 mm