COPPER(II) HEXAFLUORO-2,4-PENTANEDIONATE, dihydrate

Product Code: AKC253
CAS No: 14781-45-4
SDS Sheets: EU | US
Pack Size
Quantity
Price
 
5 g
$60.00
50 g
$410.00
2 kg
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Product data and descriptions listed are typical values, not intended to be used as specification.

  • Einecs Number

    238-850-1
  • HMIS

    3-1-0-X
  • Molecular Formula

    C10H2CuF12O4·2H2O
  • Molecular Weight (g/mol)

    477.64/513.68
  • TSCA

    No
  • Boiling Point (˚C/mmHg)

    100° / 0.5 sub
  • Melting Point (˚C)

    130°

Application

Employed in CVD of superconductors.1
Catalyst for addition of diazopentanediones to aldehydes and ketones to form dioxoles.2
Cu thin films deposited with H2 at 250°.3,4,5
Forms ferromagnetic chains on photolysis with diazodi-4-pyridylmethane.6

Reference

1. Nemota, M. et al. J. Mater. Res. 1990, 5, 1.
2. Alonso, M. et al. J. Org. Chem. 1985, 50, 3445.
3. VanHemert, R. et al. J. Electrochem. Soc. 1965, 112, 1123.
4. Mosher, R. et al. U.S. Patent 3,356,527, 1967.
5. Eisenbraun, E. et al. In Advanced Metallization for ULSI Applications, 1992, Cale, T. et al. Ed.;MRS, 1993, p. 107.
6. Sano, Y. et al. J. Am. Chem. Soc. 1997, 119, 8246.

Safety

  • Packaging Under

    Nitrogen
  • ALD Material

    Atomic layer deposition (ALD) is a chemically self-limiting deposition technique that is based on the sequential use of a gaseous chemical process. A thin film (as fine as -0.1 Å per cycle) results from repeating the deposition sequence as many times as needed to reach a certain thickness. The major characteristic of the films is the resulting conformality and the controlled deposition manner. Precursor selection is key in ALD processes, namely finding molecules which will have enough reactivity to produce the desired films yet are stable enough to be handled and safely delivered to the reaction chamber.

    Copper (II) hexafluoro-2,4-pentanedionate, dihydrate; Cupric hexafluoroacetylacetonate

  • Vapor pressure, 50 °C: 1 mm
  • Vapor pressure, 95 °C: 10 mm
  • Solubility, methanol: >200 g/L
  • Soluble: methanol, acetone, toluene
  • Employed in CVD of superconductors
  • Catalyst for addition of diazopentanediones to aldehydes and ketones to form dioxoles
  • Cu thin films deposited with H2 at 250 °C
  • Forms ferromagnetic chains on photolysis with diazodi-4-pyridylmethane