6063-89-4

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DIMETHYLISOPROPOXYALUMINUM

Product Code: OMAL025

Cas No: 6063-89-4

Pack Size

Price

10 g
$561.00
ALD Material

Atomic layer deposition (ALD) is a chemically self-limiting deposition technique that is based on the sequential use of a gaseous chemical process. A thin film (as fine as -0.1 Å per cycle) results from repeating the deposition sequence as many times as needed to reach a certain thickness. The major characteristic of the films is the resulting conformality and the controlled deposition manner. Precursor selection is key in ALD processes, namely finding molecules which will have enough reactivity to produce the desired films yet are stable enough to be handled and safely delivered to the reaction chamber.

Dimethylisopropoxyaluminum; Dimethyl(2-propanolato)-aluminum; Dimethylaluminum isopropoxide
  • Vapor pressure, 70 °C: 10 mm
  • Boiling Point: 186°

    Molecular Weight: 116.13

    Specific Gravity: 0.824

    Flashpoint: 5°C (41°F)

    HMIS Key: 4-4-2-X

    Hydrolytic Sensitivity: 10: reacts extremely rapidly with moisture and oxygen - may be pyrophoric - sealed system required

    Formula: C5H13AlO

    Additional Properties: Vapor pressure, 70°: 10 mm