1,4-DISILABUTANE

Product Code: SID4593.0
CAS No: 4364-07-2
SDS Sheets: EU | US
Navigate this page...
4364-07-2
Save for Later
Pack Size
Quantity
Price
 
5 g
$275.00

Prices listed are EXW price (Morrisville, PA US) in USD. Prices vary depending on currency and Incoterms.

Product data and descriptions listed are typical values, not intended to be used as specification.

  • Synonyms

    1,2-ETHANEDIYLBIS(SILANE)
  • HMIS

    2-4-2-X
  • Molecular Formula

    C2H10Si2
  • Molecular Weight (g/mol)

    90.27
  • Purity (%)

    97%
  • TSCA

    No
  • Autoignition Temp (˚C)

    152
  • Boiling Point (˚C/mmHg)

    45-46
  • Density (g/mL)

    0.697
  • Flash Point (˚C)

    -31 °C
  • Melting Point (˚C)

    -15°
  • Refractive Index @ 20˚C

    1.4141

Additional Properties

  • Hydrolytic Sensitivity

    9: reacts extremely rapidly with atmospheric moisture - may be pyrophoric - glove box or sealed system required

    • Application

    Bonds to oxide-free titanium, gold and silicon substrates.1
    Forms 0.2-1.7% carbon doped silicon films.2

    Reference

    1. Arkles, B. et al. J. Adhes. Sci. Technol. 2012, 26, 41.
    2. Okada, L. et al. Surf. Sci. 1998, 418, 353.

    Safety

  • Packaging Under

    Nitrogen

    • Volatile Carbosilane

    Carbosilanes are compounds in which the elements of silicon and carbon alternate in a molecular framework or polymeric backbone in an approximate ratio of 1:1. By appropriate selection of the carbosilane precursor and deposition conditions the silicon carbide framework can be shifted toward substituted silicon and diamond-like structures.

    1,4-Disilabutane; 1,2-Ethanediylbis(silane); Disilylethane; 1,4-DSB

  • CAUTION: VAPORS HAVE BEEN REPORTED TO SPONTANEOUSLY IGNITE

  • Bonds to oxide-free titanium, gold and silicon substrates
  • Forms 0.2-1.7% carbon doped silicon films

    • Silicon Chemistry, Applied Technology, Metal-Organic Chemistry, Applied Chemistry & Physics

    Low Temperature Inorganic CVD of Ti-Si-N Diffusion Barrier Liners for Gigascale Copper Interconnect Applications – Eisenbraun et al.

    Silicon Chemistry, Applied Technology

    Silicon Nitride Films by Atmospheric Pressure CVD

    Silicon Chemistry, Applied Technology, Metal-Organic Chemistry, Applied Chemistry & Physics

    Synthesizing Low-k CVD Materials for Fab Use – Arkles et al.

    Silicon Chemistry, Applied Technology, Applied Technology

    Thin-Film Deposition of Silicon Nitrides and Oxides from Trihydridosilanes