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- HMIS 3-1-1-X
- Molecular Formula C20H29O3PSi
- Molecular Weight (g/mol) 376.50
- TSCA Yes
- Boiling Point (˚C/mmHg) 182/1.3
- Density (g/mL) 1.05
- Flash Point (˚C) 134 °C
- Refractive Index @ 20˚C 1.5384
Adhesion promoter for gold substrates in microelectronic applications.1
Forms stable bonds to silica and basic alumina suitable for catalyst immobilization.2
Forms luminescent gels on hydrolysis with (EtO)4Si and Eu(NO3)3.3
Used to immobilize an iridium catalyst for the enantioselective hydrogenation of aryl ketones.4
Used in the preparation of solid-phase Pd catalyst for Suzuki-Miyaura cross-coupling.5
1. Helbert, J. U.S. Patent 4,497,890, 1985.
2. Merchle, C. H. et al. Chem. Mater. 2001, 13, 3617.
3. Corriu, R. et al. J. Chem. Soc., Chem. Commun. 2001, 1116.
4. Liu, G. et al. Adv. Synth. Catal. 2008, 350, 1464.
5. >Zhang, X. et al. Synthesis, 2011, 2975.