DIMETHYLCHLOROSILANE, 99%

Product Code: SID4070.1
CAS No: 1066-35-9
SDS Sheets: EU | US
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Product data and descriptions listed are typical values, not intended to be used as specification.

  • Einecs Number

    213-912-0
  • HMIS

    3-4-2-X
  • Molecular Formula

    C2H7ClSi
  • Molecular Weight (g/mol)

    94.62
  • Purity (%)

    99%
  • TSCA

    Yes
  • Delta H Vaporization (kJ/mol)

    6.27 kcal/mole
  • Boiling Point (˚C/mmHg)

    36
  • Coefficient of Thermal Expansion (x10-4 K-1)

    0.116
  • Density (g/mL)

    0.868
  • Flash Point (˚C)

    -25 °C
  • Melting Point (˚C)

    -111°
  • Refractive Index @ 20˚C

    1.3827

Additional Properties

  • Hydrolytic Sensitivity

    8: reacts rapidly with moisture, water, protic solvents
  • Surface Tension (mN/m)

    17.1

    • Safety

  • Packaging Under

    Nitrogen

    • Tri-substituted Silane Reducing Agent

    Organosilanes are hydrocarbon-like and possess the ability to serve as both ionic and free-radical reducing agents. These reagents and their reaction by-products are safer and more easily handled and disposed than many other reducing agents. The metallic nature of silicon and its low electronegativity relative to hydrogen lead to polarization of the Si-H bond yielding a hydridic hydrogen and a milder reducing agent compared to aluminum-, boron-, and other metal-based hydrides. A summary of some key silane reductions are presented in Table 1 of the Silicon-Based Reducing Agents brochure.

    Dimethylchlorosilane; Chlorodimethylsilane; Dimethylsilyl chloride

  • ?Hvap: 26.2 kJ/mol
  • Surface tension: 17.1 mN/m
  • Specific heat: 1.13 J/g/°C
  • Thermal conductivity: 0.116 W/mK
  • Critical temperature: 202 °C
  • Undergoes hydrosilylation reactions
  • Enantioselectively converts ?-hydroxyketones to 1,2-diols
  • Will form high-boiling polymeric by-products with aqueous work-up
  • Extensive review of silicon based reducing agents: Larson, G.; Fry, J. L. "Ionic and Organometallic-Catalyzed Organosilane Reductions", Wipf, P., Ed.; Wiley, 2007