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- Einecs Number 225-216-4
- HMIS 3-2-0-X
- Molecular Formula C18H39O3P
- Molecular Weight (g/mol) 334.47
- TSCA Yes
- Boiling Point (˚C/mmHg) NA
- Melting Point (˚C) 100-1°
Additional Properties
Application
Component in CdS synthesis - leads to nanowire formation.1
Reference
1. Xi, L. et al, Thin Solid Films 2009, 517, 6430.
Safety
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Metal-Organics
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