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Cut Curing Times and Temperatures with New Self-Bonding
Silicone Potting Compound for Protection of Electronic Devices.
Highlighting Gelest®PP2-SP01
Presented by: Michael Watson – Group Leader, Formulated Products
Defending Against the Elements:
Explore how silicone potting materials shield electronics from moisture, oxidation, corrosion, and leakage current. Ensure your devices thrive in any environment.
Cost Saving and Efficiency:
Gelest®PP2-SP01’s low-temperature curing and self-bonding capabilities bring a new era of adhesion to temperature-sensitive substrates. Boost productivity and elevate your manufacturing processes.
Strength without Stress:
Surpasses competitors with higher elongation and tensile strength, minimizing stress on delicate electronic components.
Gelest is a Mitsubishi Chemical Group Company.
