GELEST® THERMALLY CONDUCTIVE GAP FILLER TC01 1.01Kg Kit

Product Code: PP2-TC01
CAS No: Not found
TDS Sheets: US
Pack Size
Quantity
Price
 
cspk
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101 g
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1.01 kg
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Product data and descriptions listed are typical values, not intended to be used as specification.

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  • HMIS

    1-1-0-X
  • TSCA

    No
  • Density (g/mL)

    2.09-2.19
  • Density Temperature (˚C)

    25.00
  • Dielectric Strength (V/m)

    20-40 kV/mm
  • Thermal Conductivity (W/m˚C, ˚C)

    0.74 - 0.86 W/mK

Additional Properties

  • Hardness

    Low
  • Safety

  • Packaging Under

    Nitrogen