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13395-16-9

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COPPER(II) 2,4-PENTANEDIONATE

Product Code: AKC260

Cas No: 13395-16-9

Pack Size

Price

50 g
$25.00
250 g
$94.00
ALD Material

Atomic layer deposition (ALD) is a chemically self-limiting deposition technique that is based on the sequential use of a gaseous chemical process. A thin film (as fine as -0.1 Å per cycle) results from repeating the deposition sequence as many times as needed to reach a certain thickness. The major characteristic of the films is the resulting conformality and the controlled deposition manner. Precursor selection is key in ALD processes, namely finding molecules which will have enough reactivity to produce the desired films yet are stable enough to be handled and safely delivered to the reaction chamber.

Copper (II) 2,4-pentanedionate; Cupric acetylacetonate
  • Color: pale blue
  • Metal content: 2.8-24.5% Cu
  • Vapor pressure, 100 °C: 0.001 mm
  • Vapor pressure, 163 °C`: 0.1 mm
  • Solubility, dimethylsulfoxide: 4.4 g/L
  • Solubility, toluene: 0.4 g/L
  • Solubility, water: 0.2 g/L
  • Stability constant, pKa dioxane/water: 9.7
  • Catalyst for the reduction of nitro-aromatics NaBH4
  • Catalyst for hydrogenation of unsaturated fats
  • Catalyst for flexible urethanes
  • Excimer laser induces deposition of copper
  • Metal-Organic Chemical Vapor Deposition (MOCVD) generates copper oxide films
  • Forms ferromagnetic chains on photolysis with diazodi-4-pyridylmethane
  • Boiling Point: 78° / .05 sub

    EINECS Number: 236-477-9

    Melting Point: 238-40° dec

    Molecular Weight: 261.76

    Specific Gravity: 1.594

    HMIS Key: 3-1-1-X

    Hydrolytic Sensitivity: TSCA

    Formula: C10H14CuO4

    TSCA: TSCA

    Application: Catalyst for the reduction of nitro-aromatics with NaBH4.1
    Catalyst for hydrogenation of unsaturated fats.2
    Catalyst for flexible urethanes.3
    Excimer laser induces deposition of copper.4
    MOCVD generates copper oxide films.5
    Forms ferromagnetic chains on photolysis with diazodi-4-pyridylmethane.6

    Reference: 1. Hanaya, K. et al. J. Chem. Soc., Perkin Trans. 1979, 1, 2409.
    2. Emken, E. et al. J. Am. Oil Chem. Soc. 1966, 43, 14.
    3. Chem. Abstr. 68, 3566d; Fr. Patent 1,481,815, 1968.
    4. Jones, C. et al. Appl. Phys. Lett. 1985, 46, 97.
    5. Ryabova, L. In Current Topics in Material Science Kaldis, E. Ed. 1981, 7, 598.
    6. Sano, Y. et al. J. Am. Chem. Soc. 1997, 119, 8246.

    Additional Properties: Solubility, toluene: 0.4 g/l
    Solubility, water: 0.2 g/l
    Stability constant, pKa dioxane/water: 9.7
    Metal content: 23.8-24.5% Cu
    Color: pale blue
    Solubility, dimethylsulfoxide: 4.4 g/l
    Vapor pressure, 100°: 0.001 mm
    Vapor pressure, 163°: 0.1 mm