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- HMIS 3-2-0-X
- Molecular Formula C12H20O4Sn
- Molecular Weight (g/mol) 346.98
- TSCA No
- Boiling Point (˚C/mmHg) NA
- Melting Point (˚C) 177-8°
Component in conductive pastes.1
1. Jpn. Patent 57 027,505; Chem. Abstr. 96, 209220.