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SILICON DIOXIDE, amorphous
A range of silica structures from 20 nm to 1 micron have been modified with silanes to reduce hydroxyl content allowing improved dispersion. Other versions have monolayers with isolated secondary amine functionality, providing controlled interactions with resins. Systems that maintain low levels of hydroxyls have improved electrical properties. Introduction of low levels of secondary amines impart improved mechanical properties particularly in high humidity environments.
Melting Point: >1,600°
Molecular Weight: 60.09
Alternative Name: Fumed silica
Specific Gravity: 2.2
HMIS Key: 2-0-0-X
Hydrolytic Sensitivity: 5: forms reversible hydrate
Refractive Index: 1.46
Additional Properties: Isoelectric point: 2.2?c: 44 mN/mpH, 4% aqueous slurry: 3.5-4.5Surface area, 200 m2/g