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- Einecs Number 231-754-0
- HMIS 3-2-1-X
- Molecular Formula I4Ti
- Molecular Weight (g/mol) 555.52
- TSCA Yes
- Boiling Point (˚C/mmHg) 377
- Density (g/mL) 4.3
- Melting Point (˚C) 150-1°
Employed in CVD of Ti and TiN films for microelectronics.1,2
In combination with SiI4 forms Ti-Si-N diffusion barriers.3
1. Faltermeier, C. et al. J. Electrochem. Soc. 1997, 144, 1002.
2. Kaloyeros, A. et al. U.S. Patent 6,090,709, 2000.
3. Eisenbraun, E. et al. J. Vac. Sci. Technol., B 2000, 18(4), 2011.