All structures are computer generated. Please rely on the product data below for placing your order. If you see any errors in structures, please email customer service so that they can be addressed.


Product Code: AKT880

Cas No: 992-92-7

100 g
25 g
ALD Material

Atomic layer deposition (ALD) is a chemically self-limiting deposition technique that is based on the sequential use of a gaseous chemical process. A thin film (as fine as -0.1 Å per cycle) results from repeating the deposition sequence as many times as needed to reach a certain thickness. The major characteristic of the films is the resulting conformality and the controlled deposition manner. Precursor selection is key in ALD processes, namely finding molecules which will have enough reactivity to produce the desired films yet are stable enough to be handled and safely delivered to the reaction chamber.

Titanium methoxide; Methyltitanate; Titanium tetramethoxide; Titanium tetra(methanolate)
  • Contains methanol
  • Metal content: 27.7-28.0% Ti
  • Photocatalytic TiO2 films prepared by ALD in combination with H2O
  • EINECS Number: 213-596-4

    Flashpoint: 48°C (118°F)

    HMIS Key: 2-3-1-X

    Hydrolytic Sensitivity: 7: reacts slowly with moisture/water

    Formula: C4H12O4Ti

    Purity: 95%


    Application: Photocatalytic TiO2 films prepared by ALD in combination with H2O.1

    Reference: 1. Pore, V. et al. Chem. Vap. Dep. 2004, 10, 143.

    Additional Properties: 27.7-28.0% Ti
    Contains methanol