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- Einecs Number 239-568-1
- HMIS 2-2-1-X
- Molecular Formula C5H7AgO2
- Molecular Weight (g/mol) 206.98
- Purity (%) 95%
- TSCA No
- Melting Point (˚C) 82-6° dec
Application
Component in low-cost glass-frit extended silver conductive pastes.1
Reference
1. Murashima, H. et al. Chem. Abstr. 106, 112172w; Jpn. Patent 61 203,502, 1986.
Safety
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