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Boiling Point: 135° / 0.25 sub
Melting Point: 192-6°
Molecular Weight: 385.91
Alternative Name: CUPRIC PHENYLBUTANEDIONATE
HMIS Key: 2-1-0-X
Hydrolytic Sensitivity: TSCA
Application: Component in photodefinable dielectric layers.1
Reference: 1. Brown, P. et al. U.S. Patent 5,326,671, 1994.
Additional Properties: Soluble: 2-ethylhexanoic acid, xyleneMetal content: 16.2-16.8% CuSlightly soluble: acetone, methanol