Gelest, Inc. offers a range of metal-organic precursors for metallization applications in microelectronic applications. Precursors are available for commonly employed metals, such as silicon, copper, aluminum, titanium, tantalum and tungsten. These precursors are volatile solids or liquids and can be used to deposit metal thin films in typical CVD or ALD processes. Typical applications are for metal interconnects or diffusion barriers, for example. In addition, Gelest offers a wide range of other precursors for metallizaton of other elements.
To search by structure, left click in the box below to display the chemdraw toolbar. Then, draw the chemical structure of interest in the box using the toolbar. When your structure is complete, click “Search by Name” or “Search by SMILES” to generate the product name or SMILES respectively. This feature will search within the Gelest product database for matching chemical names or SMILES. Note: In cases where Gelest uses alternate chemical names, it may be necessary to search for the product of interest by its CAS#.