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MEMS are micro-electro-mechanical structures produced by methodologies generally consistent with scales and techniques associated with monolithic integrated circuit (microchip) fabrication. The integration of mechanical sensors and actuators involves a broader range of material technologies and concerns than in integrated circuit technology.
Listed below are materials specifically used for MEMS. Please consult Gelest Application Sites for “Chemical Vapor Deposition”, “Nanotechnology”, “Self-“Assembled Monolayers” and “Dielectrics”.
Silicon Dioxide Thin Films
CVD precursors
| SIT7110.2 | Tetraethoxysilane (TEOS) |
| SID2790.0 | Di-t-butoxdiacetoxysilane (DABS) |
| SID2754.6 | Dibenzyloxydiacetoxysilane |
UV Conversion Coatings
| These materials develop directly to SiO2 on exposure to deep UV |
| PP1-SESIA | Seramic SI-A |
| SST-BBE1.2 | Poly(2-bromoethylsilsesquoxane) |
Anti-stiction Coatings
Siloxane Class
| SIO6705.1 | Octaphenylcyclotetrasiloxane |
| SIT7530.0 | Tetramethylcyclotetrasiloxane |
Fluorosilane Class
| SIT8175.0 | (Tridecafluorotetrahydrooctyl)triethoxysilane |
| SIB1710.0 | Bis(pentafluoropheny)dimethoxysilane |
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