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Dielectric materials are commonly referred to as electrical insulators. Material applications range from conventional insulators in electrical and microelectronic encapsulation to applications where dielectric properties are controlled for active device architectures.
Under the influence of small fields electrons move quite freely through conductors, whereas in insulators or dielectric materials fields displace electrons only slightly from their equilibrium conditions. The slight displacement of electrons is said to polarize the dielectric. The dielectric constant is related to induced polarization and permanent dipole. In actual applications dielectric materials have a wide range of compositions and physical forms. Listed below are conventional insulators as well as precursors or intermediates for structures with controlled dielectric properties.
Insulators for electrical and microelectronic applications
| Fluids |
| DMS-T21 | Polydimethylsiloxane |
| DMS-T25 | Polydimethylsiloxane |
| Coatings |
| PP1-ZPFN | Zipcone FN |
| Encapsulants |
| PP2-OE41 | Gelest OE41 |
Precursors for dielectric films and structures with controlled properties
| High k |
| -gate dielectrics |
| AKH325.1 | Hafnium n-Butoxide (solution) |
| OMHF080 | Hafnium Dimethylamide |
| AKZ965 | Zirconium -2-Methyl-2-butoxide |
| -display devices |
| DBATI50 | Barium Titanate sol-gel precursor |
| -SiN precursors |
| SIH5905.0 | Hexachlorodisilane |
| SIT7123.0 | Tetraiodosilane |
| Low k CVD precursors |
| SIT8570.0 | Trimethylsilane (3MS) |
| SIT7530.0 | Tetramethylcyclotetrasiloxane |
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